Chengdu Cesgate Technology Co., Ltd

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chengdu,China

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  • China Thermal Profiles BGA Rework PCB Fabrication Assembly CE FCC Rohs for sale
  • China Thermal Profiles BGA Rework PCB Fabrication Assembly CE FCC Rohs for sale

Thermal Profiles BGA Rework PCB Fabrication Assembly CE FCC Rohs

Product Details

CESGATE
NA
UL、IATF16949、ISO9001
China
1PCS( NO MOQ)
Negotiable (Depends on your GERBER and BOM)
T/T, L/C
13kk solding spot/day
3-7 working days
PCB: Vacuum Packing / PCBA: ESD Packing
Thermal Profiles BGA Rework X-ray Inspection Turnkey PCB Assembly Box Build
BGA Rework
14
FUJI NXT3/XPF laminator
FR4/M4/M6/Rogers/TU872/IT968
700*460mm
AOI/SPI/XRAY/First Article Inspection
HDI Blind Buried Hole Process, High BGA Density, Small Hole-To-Line Spacing
Product Description >

Company Profile

Chengdu Cesgate Technology Co., Ltd
Site Member
chengdu,China
Manufacturer
Distributor/Wholesaler
Exporter
Seller

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